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Chip Quik Lead-Free No-Clean T3 Solder Paste (10cc)
Specifications
  • Alloy: Sn96.5/Ag3.0/Cu0.5
  • Flux Type: Synthetic No-Clean
  • Flux Classification: REL0
  • Metal Content: 87% metal by weight.
  • Particle Size: T3 (25-45 microns)
  • Melting Point: 217-220C (423-428F)
  • Size: 10cc/35g syringe

Shelf Life
  • Refrigerated >6 months, unrefrigerated >2 months

Stencil Life
  • >8 hours @ 20-50% RH 22-28C (72-82F)
  • >4 hours @ 50-70% RH 22-28C (72-82F)


Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

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