- Alloy: Sn96.5/Ag3.0/Cu0.5
- Flux Type: Synthetic No-Clean
- Flux Classification: REL0
- Metal Content: 87% metal by weight.
- Particle Size: T3 (25-45 microns)
- Melting Point: 217-220C (423-428F)
- Size: 10cc/35g syringe
- Refrigerated >6 months, unrefrigerated >2 months
- >8 hours @ 20-50% RH 22-28C (72-82F)
- >4 hours @ 50-70% RH 22-28C (72-82F)
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
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