Chip Quik No-Clean T3 Solder Paste (10cc)
  • Alloy: Sn63/Pb37
  • Flux Type: Synthetic No-Clean
  • Flux Classification: REL0
  • Metal Content: 88% metal by weight.
  • Particle Size: T3 (25-45 microns)
  • Melting Point: 183C (361F)
  • Size: 10cc/35g syringe

Shelf Life
  • Refrigerated >12 months, unrefrigerated >6 months

Stencil Life
  • >8 hours @ 20-50% RH 22-28C (72-82F)
  • >4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.


WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to:

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